FEATURES
• Batch process design, excellent power dissipation offers.better reverse leakage current and thermal resistance.
• Low profile surface mounted application.in order to optimize board space.
• Low power loss and low forward voltage drop
• High surge, high current capability, and high efficiency.
• Fast switching for high efficiency.
• Guard-ring for overvoltage protection.
• Ultra high-speed switching
• Silicon epitaxial planar chip, metal silicon junction.