QSOP Datasheet(PDF) - Amkor Technology

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QSOP Datasheet (PDF) - Amkor Technology

QSOP Datasheet PDF - Amkor Technology


No. de pieza	QSOP

Descarga	QSOP Descarga

Tamaño del archivo	475.9 Kbytes

Page	2 Pages

Fabricante Electrónico	AMKOR [Amkor Technology]

Página de inicio	http://www.amkor.com

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Descripción Electrónicos

SSOP (Shrink Small-Outline Package) and QSOP (Quarter-Size Small Outline Package) are leadframe based, plastic encapsulated packages

QSOP Datasheet (PDF)

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QSOP Datasheet PDF - Amkor Technology


No. de pieza	QSOP

Descarga	QSOP Click to download

Tamaño del archivo	475.9 Kbytes

Page	2 Pages

Fabricante Electrónico	AMKOR [Amkor Technology]

Página de inicio	http://www.amkor.com

Logo

Descripción Electrónicos	SSOP (Shrink Small-Outline Package) and QSOP (Quarter-Size Small Outline Package) are leadframe based, plastic encapsulated packages

QSOP Datasheet (HTML) - Amkor Technology

QSOP Datasheet HTML 1Page - Amkor Technology

QSOP Datasheet HTML 2Page - Amkor Technology

QSOP Detalles de producto

FEATURES
Cu wire interconnect for low cost
Standard JEDEC package outlines
Multi-die production capability
Turnkey test services, including strip test options
Green materials are standard – Pb-free and RoHS compliant
Stealth dicing (narrow saw streets)
Larger/Higher density leadframe strips
Leadframe roughening for improved MSL capability

Número de pieza similar - QSOP

Fabricante Electrónico	No. de pieza	Datasheet	Descripción Electrónicos
Amkor Technology	QSOP	433Kb / 2P	Shrink Small Outline, Quarter-Size Small-Outline Packages
TT Electronics.	QSOP	442Kb / 4P	RoHS compliant and Sn/Pb terminations available
Diodes Incorporated	QSOP-16	404Kb / 27P	SUGGESTED PAD LAYOUT Rev 52
Diodes Incorporated	QSOP-20	404Kb / 27P	SUGGESTED PAD LAYOUT Rev 52
Fairchild Semiconductor	QSOP-24	78Kb / 1P	Package MQA24

Descripción similar - QSOP

Fabricante Electrónico	No. de pieza	Datasheet	Descripción Electrónicos
STMicroelectronics	SSOP24	59Kb / 4P	24-LEAD SHRINK SMALL OUTLINE PACKAGE Nov-2002
fujitsu semiconductor	FPT-20P-M04	37Kb / 1P	THIN SHRINK SMALL OUTLINE PACKAGE
Amkor Technology	CSSOP	304Kb / 1P	Ceramic Shrink Small Outline Package
Analog Devices	RQ-16	60Kb / 1P	16-Lead Shrink Small Outline Package [QSOP] Dimensions shown in inches
ACCUTEK MICROCIRCUIT CO...	AK06D300-QSOP	174Kb / 4P	Quarter Size Small Outline Package QSOP DIP Adapters
ACCUTEK MICROCIRCUIT CO...	AK16D300	79Kb / 3P	Shrink Small Outline Package SSOP DIP Adapters
Advanced Power Electron...	AP2306AGEN-HF	101Kb / 4P	Small Outline Package
Advanced Power Electron...	AP2318AGEN-HF	64Kb / 4P	Small Outline Package
Amkor Technology	SSOP	433Kb / 2P	Shrink Small Outline, Quarter-Size Small-Outline Packages
Guangdong Youtai Semico...	LM75B	312Kb / 23P	plastic thin shrink small outline package; 8 leads;

Acerca de Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Esta información es solo para fines informativos generales, no seremos responsables de ninguna pérdida o daño causado por la información anterior.

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