PPGA Datasheet(PDF) - Amkor Technology

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PPGA Datasheet (PDF) - Amkor Technology

PPGA Datasheet PDF - Amkor Technology


No. de pieza	PPGA

Descarga	PPGA Descarga

Tamaño del archivo	304.73 Kbytes

Page	1 Pages

Fabricante Electrónico	AMKOR [Amkor Technology]

Página de inicio	http://www.amkor.com

Logo

Descripción Electrónicos

Plastic Pin Grid Array Package

PPGA Datasheet (PDF)

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PPGA Datasheet PDF - Amkor Technology


No. de pieza	PPGA

Descarga	PPGA Click to download

Tamaño del archivo	304.73 Kbytes

Page	1 Pages

Fabricante Electrónico	AMKOR [Amkor Technology]

Página de inicio	http://www.amkor.com

Logo

Descripción Electrónicos	Plastic Pin Grid Array Package

PPGA Datasheet (HTML) - Amkor Technology

PPGA Datasheet HTML 1Page - Amkor Technology

Número de pieza similar - PPGA

Fabricante Electrónico	No. de pieza	Datasheet	Descripción Electrónicos
Hammond Manufacturing L...	PPG	69Kb / 1P	Panneau de ventilation
SAB North America	PPG-11	176Kb / 1P	Polyamide 6 Cord Grips
	PPG-11R	176Kb / 1P	Polyamide 6 Cord Grips
	PPG-13	176Kb / 1P	Polyamide 6 Cord Grips
	PPG-13R	176Kb / 1P	Polyamide 6 Cord Grips

Descripción similar - PPGA

Fabricante Electrónico	No. de pieza	Datasheet	Descripción Electrónicos
Fujitsu Component Limit...	BGA-320P-M06	34Kb / 1P	PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC
Amkor Technology	CPGA	533Kb / 1P	Ceramic Pin Grid Array Package
National Semiconductor ...	UP159A	70Kb / 1P	159 Pin Molded Plastic Pin Grid Array NS Package Number UP159A
	U99A	65Kb / 1P	99 Pin Ceramic Pin Grid Array NS Package Number U99A
	U84C	71Kb / 1P	84 Pin Ceramic Pin Grid Array
	U120A	69Kb / 1P	120 Pin Ceramic Pin Grid Array
Amkor Technology	CLGA	357Kb / 1P	Ceramic Land Grid Array Package
Precid-Dip Durtal SA	510-93-108-12-051-001	33Kb / 1P	Pin grid array sockets Solder tail
Precid-Dip Durtal SA	612-93-108-12-051-001	53Kb / 1P	Pin grid array sockets Carrier types
National Semiconductor ...	MKT-U323A	59Kb / 1P	PIN GRID ARRAY CERAMIC, CAVITY DOWN, 323 PIN

Acerca de Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Esta información es solo para fines informativos generales, no seremos responsables de ninguna pérdida o daño causado por la información anterior.

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