This LFPAK ultrafast rectifier provides fast switching performance
with soft recovery in a compact thermally efficient package. The
LFPAK package provides an excellent alternative to the DPAK,
offering thermal performance nearly as good in a package occupying
less than half the board space. Its low profile makes it a good option
for flat panel display and other applications with limited vertical
clearance. The device offers low leakage over temperature making it a
good match for applications requiring low quiescent current.
Features
• New Package Provides Capability of Inspection and Probe After
Board Mounting
• Low Forward Voltage Drop
• 175°C Operating Junction Temperature
• Excellent Ability to Absorb Stresses Associated with Power
Temperature Cycling
• NRV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Mechanical Characteristics:
• Case: Epoxy, Molded
• Lead Finish: 100% Matte Sn (Tin)
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
• Device Meets MSL 1 Requirements
Applications
• Excellent Alternative to DPAK in Space−Constrained Automotive
Applications
• Very Low Leakage for Higher Temperature Operation
• Output Rectification in Compact Portable Consumer Applications
• Freewheeling Diode used with Inductive Loads