1 Features
• Scalable CMOS amplifier for low-cost applications
• Rail-to-rail input and output
• Low input offset voltage: ±0.4 mV
• Unity-gain bandwidth: 1 MHz
• Low broadband noise: 27 nV/√Hz
• Low input bias current: 5 pA
• Low quiescent current: 60 μA/Ch
• Unity-gain stable
• Internal RFI and EMI filter
• Operational at supply voltages as low as 1.8 V
• Easier to stabilize with higher capacitive load due
to resistive open-loop output impedance
• Extended temperature range: –40°C to 125°C

2 Applications
• Sensor signal conditioning
• Power modules
• Active filters
• Low-side current sensing
• Smoke detectors
• Motion detectors
• Wearable devices
• Large and small appliances
• EPOS
• Barcode scanners
• Personal electronics
• HVAC: heating, ventilating, and air conditioning
• Motor control: AC induction

3 Description
The TLV900x family includes single (TLV9001), dual
(TLV9002), and quad-channel (TLV9004) low-voltage
(1.8 V to 5.5 V) operational amplifiers (op amps)
with rail-to-rail input and output swing capabilities.
These op amps provide a cost-effective solution
for space-constrained applications such as smoke
detectors, wearable electronics, and small appliances
where low-voltage operation and high capacitive-load
drive are required. The capacitive-load drive of the
TLV900x family is 500 pF, and the resistive openloop
output impedance makes stabilization easier with
much higher capacitive loads. These op amps are
designed specifically for low-voltage operation (1.8 V
to 5.5 V) with performance specifications similar to the
TLV600x devices.
The robust design of the TLV900x family simplifies
circuit design. The op amps feature unity-gain
stability, an integrated RFI and EMI rejection filter, and
no-phase reversal in overdrive conditions.
The TLV900x devices include a shutdown mode
(TLV9001S, TLV9002S, and TLV9004S) that allow the
amplifiers to switch off into standby mode with typical
current consumption less than 1 μA.
Micro-size packages, such as SOT-553 and WSON,
are offered for all channel variants (single, dual, and
quad), along with industry-standard packages such as
SOIC, MSOP, SOT-23, and TSSOP packages.