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MPC8270CVVFX Datasheet (PDF) - NXP Semiconductors

MPC8270CVVFX Datasheet PDF - NXP Semiconductors
No. de pieza MPC8270CVVFX
Descarga  MPC8270CVVFX Descarga
Tamaño del archivo   928.17 Kbytes
Page   83 Pages
Fabricante Electrónico  NXP [NXP Semiconductors]
Página de inicio  http://www.nxp.com
Logo NXP - NXP Semiconductors
Descripción Electrónicos PowerQUICC II Family Hardware Specifications

MPC8270CVVFX Datasheet (PDF)

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MPC8270CVVFX Datasheet PDF - NXP Semiconductors

No. de pieza MPC8270CVVFX
Descarga  MPC8270CVVFX Click to download

Tamaño del archivo   928.17 Kbytes
Page   83 Pages
Fabricante Electrónico  NXP [NXP Semiconductors]
Página de inicio  http://www.nxp.com
Logo NXP - NXP Semiconductors
Descripción Electrónicos PowerQUICC II Family Hardware Specifications

MPC8270CVVFX Datasheet (HTML) - NXP Semiconductors


MPC8270CVVFX Detalles de producto

Features
The major features of the SoC are as follows:
• Dual-issue integer (G2_LE) core
— A core version of the EC603e microprocessor
— System core microprocessor supporting frequencies of 166–450 MHz
— Separate 16 KB data and instruction caches:
– Four-way set associative
– Physically addressed
– LRU replacement algorithm
— Power Architecture®-compliant memory management unit (MMU)
— Common on-chip processor (COP) test interface
— High-performance (SPEC95 benchmark at 450 MHz; 855 Dhrystones MIPS at 450 MHz)
— Supports bus snooping
— Support for data cache coherency
— Floating-point unit (FPU)
• Separate power supply for internal logic and for I/O
• Separate PLLs for G2_LE core and for the communications processor module (CPM)
— G2_LE core and CPM can run at different frequencies for power/performance optimization
— Internal core/bus clock multiplier that provides ratios 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 4.5:1, 5:1, 6:1,
7:1, 8:1
— Internal CPM/bus clock multiplier that provides ratios 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 5:1, 6:1, 8:1
ratios
• 64-bit data and 32-bit address 60x bus
— Bus supports multiple master designs
— Supports single- and four-beat burst transfers
— 64-, 32-, 16-, and 8-bit port sizes controlled by on-chip memory controller
— Supports data parity or ECC and address parity
• 32-bit data and 18-bit address local bus
— Single-master bus, supports external slaves
— Eight-beat burst transfers
— 32-, 16-, and 8-bit port sizes controlled by on-chip memory controller
• 60x-to-PCI bridge
— Programmable host bridge and agent
— 32-bit data bus, 66.67/83.3/100 MHz, 3.3 V
— Synchronous and asynchronous 60x and PCI clock modes
— All internal address space available to external PCI host
— DMA for memory block transfers
— PCI-to-60x address remapping
• PCI bridge
— PCI Specification Revision 2.2 compliant and supports frequencies up to 66 MHz
— On-chip arbitration
— Support for PCI-to-60x-memory and 60x-memory-to-PCI streaming
— PCI host bridge or peripheral capabilities
— Includes 4 DMA channels for the following transfers:
– PCI-to-60x to 60x-to-PCI
– 60x-to-PCI to PCI-to-60x
– 60x-to-PCI to 60x-to-PCI
— Includes all of the configuration registers (which are automatically loaded from the EPROM
and used to configure the MPC8280) required by the PCI standard as well as message and
doorbell registers
— Supports the I2O standard
— Hot-swap friendly (supports the hot swap specification as defined by PICMG 2.1 R1.0 August
3, 1998)
— Support for 66.67/83.33/100 MHz, 3.3 V specification
— 60x-PCI bus core logic that uses a buffer pool to allocate buffers for each port
— Uses the local bus signals, removing need for additional pins
• System interface unit (SIU)
— Clock synthesizer
— Reset controller
— Real-time clock (RTC) register
— Periodic interrupt timer
— Hardware bus monitor and software watchdog timer
— IEEE 1149.1 JTAG test access port
• 12-bank memory controller
— Glueless interface to SRAM, page mode SDRAM, DRAM, EPROM, Flash, and other
user-definable peripherals
— Byte write enables and selectable parity generation
— 32-bit address decodes with programmable bank size
— Three user-programmable machines, general-purpose chip-select machine, and page mode
pipeline SDRAM machine
— Byte selects for 64-bit bus width (60x) and byte selects for 32-bus width (local)
— Dedicated interface logic for SDRAM
• CPU core can be disabled and the device can be used in slave mode to an external core
• Communications processor module (CPM)
— Embedded 32-bit communications processor (CP) uses a RISC architecture for flexible support
for communications protocols
— Interfaces to G2_LE core through an on-chip 32 KB dual-port data RAM, an on-chip 32 KB
dual-port instruction RAM and DMA controller
— Serial DMA channels for receive and transmit on all serial channels
— Parallel I/O registers with open-drain and interrupt capability
— Virtual DMA functionality executing memory-to-memory and memory-to-I/O transfers
— Three fast communications controllers supporting the following protocols:
– 10/100-Mbit Ethernet/IEEE 802.3 CDMA/CS interface through media independent
interface (MII) or reduced media independent interface (RMII)
– ATM—Full-duplex SAR protocols at 155 Mbps, through UTOPIA interface, AAL5, AAL1,
AAL0 protocols, TM 4.0 CBR, VBR, UBR, ABR traffic types, up to 64 K external
connections (no ATM support for the MPC8270)
– Transparent
– HDLC—Up to T3 rates (clear channel)
– FCC2 can also be connected to the TC layer (MPC8280 only)
— Two multichannel controllers (MCCs) (one MCC on the MPC8270)
– Each MCC handles 128 serial, full-duplex, 64-Kbps data channels. Each MCC can be split
into four subgroups of 32 channels each.
– Almost any combination of subgroups can be multiplexed to single or multiple TDM
interfaces up to four TDM interfaces per MCC
— Four serial communications controllers (SCCs) identical to those on the MPC860, supporting
the digital portions of the following protocols:
– Ethernet/IEEE 802.3 CDMA/CS
– HDLC/SDLC and HDLC bus
– Universal asynchronous receiver transmitter (UART)
– Synchronous UART
– Binary synchronous (BISYNC) communications
– Transparent
Universal serial bus (USB) controller
— Supports USB 2.0 full/low rate compatible
— USB host mode
– Supports control, bulk, interrupt, and isochronous data transfers
– CRC16 generation and checking
– NRZI encoding/decoding with bit stuffing
– Supports both 12- and 1.5-Mbps data rates (automatic generation of preamble token and
data rate configuration). Note that low-speed operation requires an external hub.
– Flexible data buffers with multiple buffers per frame
– Supports local loopback mode for diagnostics (12 Mbps only)
— Supports USB slave mode
– Four independent endpoints support control, bulk, interrupt, and isochronous data transfers
– CRC16 generation and checking
– CRC5 checking
– NRZI encoding/decoding with bit stuffing
– 12- or 1.5-Mbps data rate
– Flexible data buffers with multiple buffers per frame
– Automatic retransmission upon transmit error
— Two serial management controllers (SMCs), identical to those of the MPC860
– Provides management for BRI devices as general-circuit interface (GCI) controllers in
time-division-multiplexed (TDM) channels
– Transparent
– UART (low-speed operation)
— One serial peripheral interface identical to the MPC860 SPI
— One I2C controller (identical to the MPC860 I2C controller)
– Microwire compatible
– Multiple-master, single-master, and slave modes
— Up to eight TDM interfaces (four on the MPC8270)
– Supports two groups of four TDM channels for a total of eight TDMs (one group of four
the MPC8270 and the MPC8275)
– 2,048 bytes of SI RAM
– Bit or byte resolution
– Independent transmit and receive routing, frame synchronization
– Supports T1, CEPT, T1/E1, T3/E3, pulse code modulation highway, ISDN basic rate, ISDN
primary rate, Freescale interchip digital link (IDL), general circuit interface (GCI), and
user-defined TDM serial interfaces
— Eight independent baud rate generators and 20 input clock pins for supplying clocks to FCCs,
SCCs, SMCs, and serial channels
— Four independent 16-bit timers that can be interconnected as two 32-bit timers
• Inverse multiplexing for ATM capabilities (IMA) (MPC8280 only). Supported by eight transfer
transmission convergence (TC) layers between the TDMs and FCC2.
• Transmission convergence (TC) layer (MPC8280 only)




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Acerca de NXP Semiconductors


NXP Semiconductors es una empresa multinacional que cotiza en bolsa que diseña, desarrolla y fabrica una amplia gama de semiconductores y circuitos integrados para diversas aplicaciones, incluidos los mercados automotrices, industriales, de comunicaciones y de consumo.

La compañía fue fundada en 2006 y tiene su sede en Eindhoven, Países Bajos.

NXP ofrece una amplia cartera de productos, incluidos microcontroladores, microprocesadores, IC de autenticación seguros, ICS de administración de energía, componentes de RF y microondas, y soluciones de sensores, entre otros.

Los productos de la compañía están diseñados para ser eficientes en energía, seguros y confiables, y se utilizan en una variedad de aplicaciones, incluidos sistemas automotrices, automatización y control industrial, casas y edificios inteligentes, y dispositivos conectados.

NXP se dedica a la innovación y la satisfacción del cliente, y se compromete a proporcionar a sus clientes las mejores soluciones de semiconductores para satisfacer sus necesidades.

*Esta información es solo para fines informativos generales, no seremos responsables de ninguna pérdida o daño causado por la información anterior.




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