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IMX8MMIEC Datasheet (PDF) - NXP Semiconductors

IMX8MMIEC Datasheet PDF - NXP Semiconductors
No. de pieza IMX8MMIEC
Descarga  IMX8MMIEC Descarga
Tamaño del archivo   2755.85 Kbytes
Page   96 Pages
Fabricante Electrónico  NXP [NXP Semiconductors]
Página de inicio  http://www.nxp.com
Logo NXP - NXP Semiconductors
Descripción Electrónicos i.MX 8M Mini Applications Processor Datasheet for Industrial Products

IMX8MMIEC Datasheet (PDF)

Go To PDF Page Descarga Datasheet
IMX8MMIEC Datasheet PDF - NXP Semiconductors

No. de pieza IMX8MMIEC
Descarga  IMX8MMIEC Click to download

Tamaño del archivo   2755.85 Kbytes
Page   96 Pages
Fabricante Electrónico  NXP [NXP Semiconductors]
Página de inicio  http://www.nxp.com
Logo NXP - NXP Semiconductors
Descripción Electrónicos i.MX 8M Mini Applications Processor Datasheet for Industrial Products

IMX8MMIEC Datasheet (HTML) - NXP Semiconductors


IMX8MMIEC Detalles de producto

Features
- Arm Cortex-A53 MPCore platform
Quad symmetric Cortex-A53 processors
• 32 KB L1 Instruction Cache
• 32 KB L1 Data Cache
• Media Processing Engine (MPE) with NEON technology supporting the Advanced
Single Instruction Multiple Data architecture:
• Floating Point Unit (FPU) with support of the VFPv4-D16 architecture
Support of 64-bit Armv8-A architecture
512 KB unified L2 cache

-Arm Cortex-M4 core platform
Low power microcontroller available for customer application:
• low power standby mode
• IoT features including Weave
• Manage IR or Wireless Remote
Cortex M4 CPU:
• 16 KB L1 Instruction Cache
• 16 KB L1 Data Cache
• 256 KB tightly coupled memory (TCM)

-Connectivity
One PCI Express (PCIe)
• Single lane supporting PCIe Gen2
• Dual mode operation to function as root complex or endpoint
• Integrated PHY interface
• Support L1 low power sub-state
Two USB 2.0 OTG controllers with integrated PHY interfaces:
• Spread spectrum clock support
Three Ultra Secure Digital Host Controller (uSDHC) interfaces:
• MMC 5.1 compliance with HS400 DDR signaling to support up to 400 MB/sec
• SD/SDIO 3.0 compliance with 200 MHz SDR signaling to support up to 100
MB/sec
• Support for SDXC (extended capacity)
One Gigabit Ethernet controller with support for Energy Efficient Ethernet (EEE),
Ethernet AVB, and IEEE 1588
Four Universal Asynchronous Receiver/Transmitter (UART) modules
Four I2C modules
Three ECSPI modules

-On-chip memory
Boot ROM (256 KB)
On-chip RAM (256 KB + 32 KB)

-GPIO and pin multiplexing
General-purpose input/output (GPIO) modules with interrupt capability
Input/output multiplexing controller (IOMUXC) to provide centralized pad control

-Power management
Temperature sensor with programmable trip points
Flexible power domain partitioning with internal power switches to support efficient
power management

-External memory interface
32/16-bit DRAM interfaces:
• LPDDR4 (up to 1.5 GHz)
• DDR4-2400
• DDR3L-1600
8-bit NAND-Flash, including support for Raw MLC/SLC devices, BCH ECC up to
62-bit, and ONFi3.2 compliance (clock rates up to 100 MHz and data rates up to 200
MB/sec)
eMMC 5.1 Flash (2 interfaces, uSDHC1 and uSDHC3)
SPI NOR Flash (3 interfaces)
FlexSPI with support for XIP (for ME in low-power mode) and parallel read mode of
two identical FLASH devices

-Multimedia
Video Processing Unit:
• 1080p60 VP9 Profile 0, 2 (10-bit)
• 1080p60 HEVC/H.265 Decoder
• 1080p60 AVC/H.264 Baseline, Main, High decoder
• 1080p60 VP8
• 1080p60 AVC/H.264 Encoder
• 1080p60 VP8
• TrustZone support
Graphic Processing Unit:
• GCNanoUltra for 3D acceleration
• GC320 for 2D acceleration
LCDIF Display Controller:
• Support up to 2 layers of overlay
• Support up to 1080p60 display through MIPI DSI
MIPI Interface:
• 4-lane MIPI CSI interface
• 4-lane MIPI DSI interface
Audio:
• S/PDIF input and output, including a new Raw Capture input mode
• Five synchronous audio interface (SAI) modules supporting I2S, AC97, TDM,
codec/DSP, and DSD interfaces, including one SAI with 8 Tx and 8 Rx lanes, one
SAI with 4 Tx and 4 Rx lanes, two SAI with 2 Tx and 2 Rx lanes, and one SAI with
1 Tx and 1Rx lane. Support over 20 channels of audio subject to I/O limitations.
• 8-Channel Pulse Density Modulation (PDM) input

-System debug
Arm CoreSight debug and trace architecture
Trace Port Interface Unit (TPIU) to support off-chip real-time trace
Embedded Trace FIFO (ETF) with 4 KB internal storage to provide trace buffering
Unified trace capability for Quad Cortex-A53 and Cortex-M4 CPUs
Cross Triggering Interface (CTI)
Support for 5-pin (JTAG) debug interface

-Security
Resource Domain Controller (RDC) supports four domains and up to eight regions of
DDR
Arm TrustZone (TZ) architecture:
• Support Arm Cortex-A53 MPCore TrustZone
On-chip RAM (OCRAM) secure region protection using OCRAM controller
High Assurance Boot (HAB)
Cryptographic acceleration and assurance (CAAM) module and Assurance Module:
• Support Widevine and PlayReady content protection
• Public Key Cryptography (PKHA) with RSA and Elliptic Curve (ECC) algorithms
• Real-time integrity checker (RTIC)
• DRM support for RSA, AES, 3DES, DES
• Side channel attack resistance
• True random number generation (RNG)
• Manufacturing protection support
Secure non-volatile storage (SNVS):
• Secure real-time clock (RTC)
Secure JTAG controller (SJC)




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Acerca de NXP Semiconductors


NXP Semiconductors es una empresa multinacional que cotiza en bolsa que diseña, desarrolla y fabrica una amplia gama de semiconductores y circuitos integrados para diversas aplicaciones, incluidos los mercados automotrices, industriales, de comunicaciones y de consumo.

La compañía fue fundada en 2006 y tiene su sede en Eindhoven, Países Bajos.

NXP ofrece una amplia cartera de productos, incluidos microcontroladores, microprocesadores, IC de autenticación seguros, ICS de administración de energía, componentes de RF y microondas, y soluciones de sensores, entre otros.

Los productos de la compañía están diseñados para ser eficientes en energía, seguros y confiables, y se utilizan en una variedad de aplicaciones, incluidos sistemas automotrices, automatización y control industrial, casas y edificios inteligentes, y dispositivos conectados.

NXP se dedica a la innovación y la satisfacción del cliente, y se compromete a proporcionar a sus clientes las mejores soluciones de semiconductores para satisfacer sus necesidades.

*Esta información es solo para fines informativos generales, no seremos responsables de ninguna pérdida o daño causado por la información anterior.




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