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  • MHO+32TFD-R

  • AI
    The **MHO+32TFD-R** is a high-precision, temperature-compensated crystal oscillator (TCXO) often utilized in telecommunications, networking, and industrial frequency control applications. It is part of the MHO series manufactured by companies like MtronPTI. --- ### 1. Key Technical Specifications The following table highlights the primary electronic characteristics of this component: | Feature | Specification | | :--- | :--- | | **Output Frequency** | Typically 32.768 MHz (Common for this series) | | **Supply Voltage ($V_{cc}$)** | +3.3 VDC (Standard) | | **Stability** | ±1.0 ppm to ±2.5 ppm (Temperature dependent) | | **Output Type** | CMOS / HCMOS | | **Operating Temperature** | -40°C to +85°C (Industrial Grade) | | **Package Style** | 5x7mm Surface Mount (SMD) | | **RoHS Status** | Compliant (R suffix denotes Lead-free/RoHS) | --- ### 2. Electronic Component Breakdown The "MHO+32TFD-R" part number follows a specific nomenclature that defines its electronic behavior: * **MHO+**: Refers to the specific product family (High-stability Crystal Oscillator). * **32**: Often designates the voltage or a specific frequency variant (3.3V is standard for this series). * **T**: Indicates **Temperature Compensation**. Unlike standard oscillators, this part adjusts for thermal drift. * **F**: Likely refers to the **Frequency Stability** grade. * **D**: Refers to the **Duty Cycle** (usually 40/60% or 45/55% symmetry). * **-R**: Indicates **RoHS compliance** (Restriction of Hazardous Substances). --- ### 3. Functional Pinout The device typically uses a 4-pin or 6-pin standard SMD configuration: 1. **Pin 1 (OE/NC):** Output Enable or No Connect. High signal allows output; Low signal puts the device in standby. 2. **Pin 2 (GND):** Circuit and Case Ground. 3. **Pin 3 (Output):** The clock signal (HCMOS wave). 4. **Pin 4 ($V_{cc}$):** Power supply input. --- ### 4. Circuit Implementation When integrating this part into a PCB design, consider the following: ```c // Design Guidelines for MHO+ Series 1. Place a 0.01µF to 0.1µF bypass capacitor as close to Pin 4 (Vcc) as possible. 2. Keep trace lengths from Pin 3 (Output) to the Load (CPU/FPGA) short to minimize EMI. 3. Ensure a solid ground plane beneath the oscillator to reduce phase noise. ``` ---
    ✨ Follow-up Questions
    • ⤷ What are the typical jitter specifications for the MHO series?
    • ⤷ How does a TCXO differ from a standard XO in terms of power consumption?
    • ⤷ Can you provide the specific frequency for the 32TFD-R variant?