Motor de Búsqueda de Datasheet de Componentes Electrónicos
  Spanish  ▼
ALLDATASHEET.ES

X  

  • M3H55FCG-R

  • AI
    The **M3H55FCG-R** is a high-performance, automotive-grade MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) manufactured by **Renesas Electronics**. It is designed specifically for power switching applications where efficiency and thermal management are critical. --- ### 1. Key Technical Specifications The following table summarizes the primary electrical characteristics of the M3H55FCG-R: | Parameter | Symbol | Value | Units | | :--- | :--- | :--- | :--- | | **Drain-to-Source Voltage** | $V_{DSS}$ | 40 | V | | **Continuous Drain Current** | $I_D$ | 150 | A | | **On-State Resistance (Max)** | $R_{DS(on)}$ | 0.70 | mΩ | | **Gate-to-Source Voltage** | $V_{GSS}$ | ±20 | V | | **Channel Temperature** | $T_{ch}$ | 175 | °C | | **Package Type** | - | HPAK-7L | - | --- ### 2. Core Features * **Ultra-Low On-Resistance ($R_{DS(on)}$):** At only 0.70 mΩ, this part minimizes conduction losses, making it highly efficient for high-current applications. * **AEC-Q101 Qualified:** It meets rigorous automotive reliability standards, ensuring it can withstand harsh environments and extreme temperatures. * **Logic Level Drive:** It can be fully turned on using standard logic-level gate voltages, simplifying the driver circuit design. * **High Thermal Performance:** The HPAK-7L package provides excellent heat dissipation, allowing for a higher continuous current rating in a compact footprint. --- ### 3. Applications The M3H55FCG-R is predominantly used in 12V automotive systems and industrial power management: 1. **Electric Power Steering (EPS):** Providing high current to the steering motor with minimal heat generation. 2. **Motor Control Units (MCU):** Used in BLDC (Brushless DC) motor drivers for cooling fans, pumps, or wipers. 3. **DC/DC Converters:** High-frequency switching for voltage regulation. 4. **Battery Management Systems (BMS):** Serving as a high-side or low-side switch for battery protection. --- ### 4. Package Dimensions (HPAK-7L) The **HPAK-7L** is a surface-mount package. Unlike standard TO-263 packages, it features multiple source pins to reduce lead inductance and electrical resistance, which is vital for high-speed switching and ultra-high current paths.
    ✨ Follow-up Questions
    • ⤷What are the specific thermal resistance values for the HPAK-7L package?
    • ⤷ How does the M3H55FCG-R compare to the M3H55FCG-L version?
    • ⤷ Can this MOSFET be used in 24V automotive systems?