## Overview of the DURIS® E 2835 (GW JCLPS2.EM) The **GW JCLPS2.EM** is a high-performance LED part of the **DURIS® E 2835** series manufactured by OSRAM Opto Semiconductors (ams OSRAM). It is a mid-power LED designed specifically for high-efficacy lighting applications where a compact form factor and uniform light distribution are required. --- ### 1. Key Technical Specifications The following table highlights the primary electrical and optical characteristics of the GW JCLPS2.EM: | Parameter | Specification | | :--- | :--- | | **Package Size** | 2.8 mm x 3.5 mm (Industry Standard 2835) | | **Forward Voltage ($V_f$)** | 2.8V to 3.4V (Typical: 3.05V) | | **Forward Current ($I_f$)** | Nominal: 65mA; Maximum: 150mA | | **Luminous Flux** | Typical 27 lm - 35 lm (depending on CCT/CRI) | | **CRI (Color Rendering Index)** | Minimum 80 (standard for EM series) | | **Viewing Angle** | 120° (Lambertian emitter) | | **Operating Temperature** | -40 °C to 100 °C | --- ### 2. Internal Electronic Components The component is more than just a diode; it consists of several integrated materials and structures: * **LED Chip:** Based on **InGaN on Sapphire** (Indium Gallium Nitride) technology, which allows for high efficiency in the blue spectrum. * **Phosphor Conversion:** A layer of phosphor is applied over the blue chip to convert light into white. The "EM" designation typically refers to specific binning and phosphor recipes for indoor lighting. * **Leadframe:** A silver-plated copper alloy leadframe provides high thermal conductivity and electrical connection points. * **Encapsulation:** Clear or diffused silicone resin protects the chip from environmental factors while maintaining optical clarity. --- ### 3. Application Areas The GW JCLPS2.EM is optimized for the following electronic systems: 1. **Retrofit Lamps:** LED bulbs (A-lamps) and tubes. 2. **Luminaires:** Area lights and downlights for office or residential use. 3. **Linear Lighting:** LED strips where consistent color and high density are needed. --- ### 4. Circuit Design Consideration When integrating this part into a PCB, engineers must consider the following: ```markdown - Current Limiting: Use a constant current driver to prevent thermal runaway. - Thermal Management: Ensure the solder pads are connected to a large copper pour to dissipate heat. - Polarity: The cathode is usually marked by a notch on the corner of the package. ```