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  • DFP201610TF-R68M

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    ## Technical Overview of DFP201610TF-R68M The **DFP201610TF-R68M** is a surface-mount (SMD) power inductor commonly used in compact electronic devices. It is part of the metal alloy chip inductor category, designed for high-efficiency power conversion in space-constrained environments. --- ### 1. Key Technical Specifications | Parameter | Specification | Details | | :--- | :--- | :--- | | **Inductance** | 0.68 µH | Rated at 1MHz | | **Tolerance** | ±20% | Standard for power inductors | | **Case Size** | 2016 (Metric) | 2.0mm x 1.6mm x 1.0mm (Height) | | **DC Resistance (DCR)** | ~37 mΩ (Max) | Low resistance for high efficiency | | **Rated Current (Isat)** | ~4.4 A | Saturation current (inductance drop 30%) | | **Rated Current (Itemp)**| ~3.5 A | Temperature rise current (ΔT=40°C) | | **Core Material** | Metal Alloy | Provides soft saturation characteristics | --- ### 2. Breakdown of the Part Number The alphanumeric code provides specific details about the component's construction: * **DFP**: Series identifier (typically indicating a thin-film or metal alloy power inductor). * **201610**: Dimensions in millimeters ($2.0 \times 1.6 \times 1.0$ mm). * **TF**: Material/Termination type (often indicates halogen-free or specific thin-film technology). * **R68**: Inductance value. "R" acts as the decimal point ($0.68$ µH). * **M**: Tolerance code ($M = \pm20\%$). --- ### 3. Core Features and Applications #### Features * **Magnetic Shielding:** The metal alloy construction reduces electromagnetic interference (EMI), which is critical for densely packed circuit boards. * **High Current Density:** Despite its small footprint, it can handle relatively high currents due to the metal powder core. * **Soft Saturation:** Unlike ferrite cores that drop inductance sharply, this part maintains performance more linearly under heavy loads. #### Typical Applications 1. **Mobile Devices:** Smartphones, tablets, and wearables. 2. **DC-DC Converters:** Used in Point-of-Load (POL) modules. 3. **Battery Powered Equipment:** Where high efficiency and low heat generation are required. 4. **CPU/GPU Power:** Voltage Regulator Modules (VRM) for low-power processors. --- ### 4. Component Comparison (Typical Metal vs. Ferrite) ```markdown Comparison of Inductor Core Technologies: - Metal Alloy (DFP Series): Better saturation, higher current, lower EMI. - Ferrite Core: Higher inductance values available, but sharp saturation and fragile. ``` ---
    ✨ Follow-up Questions
    • What is the difference between Isat and Itemp for this inductor?
    • Are there recommended PCB footprint patterns for the 2016 package?
    • What are the common alternatives to the DFP201610 series?