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  • CMPS5063

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    The **CMPS5063** (often associated with high-performance industrial or automotive computing modules, specifically COM Express Type 6 architectures) is a sophisticated embedded system component. Below is a breakdown of its electronic architecture and key specifications. --- ## 1. Core Architecture The module is built on the **COM Express Compact** form factor, integrating a high-performance CPU with support circuitry. | Component Category | Description | | :--- | :--- | | **Processor (CPU)** | Typically features Intel® Core™ i7/i5/i3 or Celeron® (6th Gen "Skylake" or newer). | | **Memory Support** | Dual-channel DDR4 SO-DIMM slots, often supporting up to 32GB. | | **Chipset** | Integrated Platform Controller Hub (PCH) managing I/O operations. | | **Graphics** | Integrated Intel® HD Graphics with support for 4K resolution. | --- ## 2. Interface and Connectivity The CMPS5063 utilizes high-speed differential signaling to communicate with a carrier board via two high-density connectors (Rows A/B and C/D). ### High-Speed I/O * **PCI Express:** Multiple lanes (typically PCIe x16 and x1) for external GPUs or FPGA expansion. * **SATA:** Support for SATA III (6Gb/s) storage devices. * **USB:** Combination of USB 3.0 (SuperSpeed) and USB 2.0 ports. ### Display Interfaces The module supports multiple concurrent displays through: 1. **Digital Display Interfaces (DDI):** HDMI, DVI, or DisplayPort. 2. **eDP/LVDS:** For direct connection to internal LCD panels. --- ## 3. Power and Thermal Management Because these parts operate in rugged environments, the power delivery system is complex. * **Voltage Rails:** Operates on a wide range input (usually +12V) with onboard DC-DC converters generating lower voltages (1.0V, 1.2V, 3.3V, 5V) for the silicon. * **Thermal Design Power (TDP):** Typically ranges from 15W to 45W, requiring a dedicated heat spreader or active heatsink. * **Management:** Includes ACPI 5.0 compliance for advanced power states (Sleep, Hibernate). --- ## 4. Firmware and Security ```json { "BIOS": "AMI UEFI BIOS", "Security": "TPM 2.0 (Trusted Platform Module) support", "Watchdog": "Programmable timer for system recovery", "H/W Monitor": "Voltages, Fan Speed, and Temperature sensing" } ``` ---
    ✨ Follow-up Questions
    • What are the specific power requirements for the CMPS5063 carrier board?
    • Does the CMPS5063 support ECC memory for industrial applications?
    • How does the COM Express Type 6 pinout differ from Type 10 in this module?