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  • ATS-P2-76-C1-R0

  • AI
    The **ATS-P2-76-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) such as CPUs, GPUs, and FPGAs. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-P2-76-C1-R0 | | **Product Category** | Heat Sinks | | **Base Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 11.50°C/W (Unducted Flow @ 100 LFM) | --- ### Key Design Elements #### 1. Fin Profile: Straight Fin This model uses a **Straight Fin** design. Straight fins are ideal for applications where there is a consistent, directional airflow. They provide a low pressure drop while maximizing the surface area available for heat transfer. #### 2. Attachment System: pushPIN™ The "P2" in the part number refers to the attachment mechanism. * **Plastic Push-Pins:** These allow for quick and secure mounting to a PCB (Printed Circuit Board). * **Compression Springs:** The pins are paired with springs to ensure a precise, uniform pressure across the component surface, which optimizes the thermal interface. #### 3. Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization layer provides corrosion resistance and increases the surface emissivity, slightly improving radiant heat transfer. --- ### Performance Overview The performance of this heat sink is measured by its **Thermal Resistance**. Lower values indicate better cooling performance. | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 11.50 | | 300 | 1.5 | 3.96 | | 500 | 2.5 | 2.40 | | 700 | 3.5 | 1.84 | --- ### Physical Dimensions * **Length/Width:** 25.00 mm x 25.00 mm * **Height:** 10.00 mm (Low profile) * **Pitch (Hole-to-Hole):** Approximately 30.00 mm ---
    ✨ Follow-up Questions
    • ⤷ What are the recommended thermal interface materials (TIM) to use with this heat sink?
    • ⤷ How do I calculate if this heat sink is sufficient for a 5W chip?
    • ⤷ Are there alternative mounting options if push-pins are not compatible with my PCB?