ATS-P2-76-C1-R0
AI

The **ATS-P2-76-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) such as CPUs, GPUs, and FPGAs.
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### Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-P2-76-C1-R0 |
| **Product Category** | Heat Sinks |
| **Base Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Thermal Resistance** | 11.50°C/W (Unducted Flow @ 100 LFM) |
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### Key Design Elements
#### 1. Fin Profile: Straight Fin
This model uses a **Straight Fin** design. Straight fins are ideal for applications where there is a consistent, directional airflow. They provide a low pressure drop while maximizing the surface area available for heat transfer.
#### 2. Attachment System: pushPIN™
The "P2" in the part number refers to the attachment mechanism.
* **Plastic Push-Pins:** These allow for quick and secure mounting to a PCB (Printed Circuit Board).
* **Compression Springs:** The pins are paired with springs to ensure a precise, uniform pressure across the component surface, which optimizes the thermal interface.
#### 3. Material and Coating
* **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio.
* **Blue Anodized Finish:** This is not just for aesthetics; the anodization layer provides corrosion resistance and increases the surface emissivity, slightly improving radiant heat transfer.
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### Performance Overview
The performance of this heat sink is measured by its **Thermal Resistance**. Lower values indicate better cooling performance.
| Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 100 | 0.5 | 11.50 |
| 300 | 1.5 | 3.96 |
| 500 | 2.5 | 2.40 |
| 700 | 3.5 | 1.84 |
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### Physical Dimensions
* **Length/Width:** 25.00 mm x 25.00 mm
* **Height:** 10.00 mm (Low profile)
* **Pitch (Hole-to-Hole):** Approximately 30.00 mm
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- ⤷
What are the recommended thermal interface materials (TIM) to use with this heat sink?
- ⤷ How do I calculate if this heat sink is sufficient for a 5W chip?
- ⤷ Are there alternative mounting options if push-pins are not compatible with my PCB?