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  • ATS-P2-74-C1-R0

  • AI
    The **ATS-P2-74-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from Advanced Thermal Solutions (ATS). It is part of their "maxiFLOW™" product line, designed to dissipate heat from high-power electronic components like CPUs, GPUs, and FPGAs. ### 1. Technical Specifications Below are the key electronic and physical specifications for the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 2.05°C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 40mm x 40mm | | **Height** | 25mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Features * **maxiFLOW™ Design:** The part features a specialized fin pattern that reduces pressure drop and increases surface area, significantly improving air-flow cooling efficiency. * **pushPIN™ Attachment:** It utilizes a high-performance spring-loaded mechanism that provides a specific, consistent pressure to the electronic component, ensuring optimal thermal contact. * **Integrated TIM:** The unit comes with T766 thermal grease pre-applied, which eliminates the need for manual application and ensures a bubble-free interface between the chip and the sink. * **Blue Anodized Coating:** This finish increases the emissivity of the surface, aiding in radiant heat transfer and providing corrosion resistance. --- ### 3. Application Use Cases This specific heat sink is typically found in environments where space is constrained but high thermal loads are generated: 1. **Telecommunications:** Used on high-speed switching and routing processors. 2. **Embedded Computing:** Cooling industrial PC processors or high-density server blades. 3. **Power Electronics:** Dissipating heat from large MOSFET arrays or power modules. --- ### 4. Thermal Performance Data Effective cooling depends on the airflow (Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 2.96 | | 200 | 2.05 | | 400 | 1.39 | | 600 | 1.15 |
    ✨ Follow-up Questions
    • ⤷ What are the specific mounting hole requirements for the pushPIN system used here?
    • ⤷ Does this model support custom height modifications for low-profile builds?
    • ⤷ How does the T766 thermal interface material compare to phase-change materials?