ATS-P2-74-C1-R0
AI

The **ATS-P2-74-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from Advanced Thermal Solutions (ATS). It is part of their "maxiFLOW™" product line, designed to dissipate heat from high-power electronic components like CPUs, GPUs, and FPGAs.
### 1. Technical Specifications
Below are the key electronic and physical specifications for the part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (Blue Anodized) |
| **Thermal Resistance** | 2.05°C/W (at 200 LFM) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W)** | 40mm x 40mm |
| **Height** | 25mm |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Key Features
* **maxiFLOW™ Design:** The part features a specialized fin pattern that reduces pressure drop and increases surface area, significantly improving air-flow cooling efficiency.
* **pushPIN™ Attachment:** It utilizes a high-performance spring-loaded mechanism that provides a specific, consistent pressure to the electronic component, ensuring optimal thermal contact.
* **Integrated TIM:** The unit comes with T766 thermal grease pre-applied, which eliminates the need for manual application and ensures a bubble-free interface between the chip and the sink.
* **Blue Anodized Coating:** This finish increases the emissivity of the surface, aiding in radiant heat transfer and providing corrosion resistance.
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### 3. Application Use Cases
This specific heat sink is typically found in environments where space is constrained but high thermal loads are generated:
1. **Telecommunications:** Used on high-speed switching and routing processors.
2. **Embedded Computing:** Cooling industrial PC processors or high-density server blades.
3. **Power Electronics:** Dissipating heat from large MOSFET arrays or power modules.
---
### 4. Thermal Performance Data
Effective cooling depends on the airflow (Linear Feet per Minute - LFM):
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 | 2.96 |
| 200 | 2.05 |
| 400 | 1.39 |
| 600 | 1.15 |
- ⤷
What are the specific mounting hole requirements for the pushPIN system used here?
- ⤷ Does this model support custom height modifications for low-profile builds?
- ⤷ How does the T766 thermal interface material compare to phase-change materials?