The **ATS-P2-72-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed for high-efficiency cooling in constrained spaces. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 25mm x 25mm x 35mm | | **Thermal Resistance** | 5.10°C/W (at 100 LFM) | | **Flow Pattern** | maxiFLOW (Tapered Fin) | | **Thermal Interface Material (TIM)** | T412 | --- ### 2. Key Electronic Features #### A. Fin Design (maxiFLOW™) Unlike standard extruded heat sinks, the **maxiFLOW™** geometry uses a tapered fin design. This maximizes the surface area for heat dissipation while minimizing the pressure drop. In electronic enclosures with limited airflow, this ensures the component stays below its critical operating temperature. #### B. pushPIN™ Attachment The "P2" in the part number indicates the attachment mechanism. The **pushPIN™** system uses a flexible spring-loaded mechanism that provides: * **Constant Pressure:** Ensures the heat sink remains in firm contact with the semiconductor (CPU, GPU, or FPGA). * **Vibration Resistance:** Securely holds the component in place during mechanical shock or shipping. #### C. Thermal Interface Material (T412) The part comes pre-applied with **T412**, a high-performance thermal tape/pad. This eliminates the "air gap" between the electronic chip and the aluminum base, significantly reducing the contact resistance. --- ### 3. Application Use Cases This specific part is typically used to cool small, high-heat-density electronic components such as: 1. **Network Switches/Routers:** Cooling ASICs and high-speed processors. 2. **Embedded Systems:** Industrial PCs where space is limited but vertical height (35mm) is available. 3. **Power Supplies:** Cooling MOSFETs or power regulators that generate concentrated heat. --- ### 4. Thermal Performance Comparison The efficiency of the heat sink changes based on the airflow (LFM - Linear Feet per Minute): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100** | 5.10 | | **300** | 2.50 | | **500** | 1.90 |