The **ATS-H1-72-C2-R0** is a high-performance electronic thermal management component, specifically a **Pin Fin Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, FPGAs, or power modules. --- ### 1. Technical Specifications The following table summarizes the core technical parameters of the ATS-H1-72-C2-R0: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL-6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Heat Sink Type** | Pin Fin | | **Length x Width** | 57.90 mm x 60.96 mm | | **Height** | 17.78 mm | | **Thermal Resistance** | 2.50 °C/W (at 200 LFM) | --- ### 2. Key Component Features #### A. Pin Fin Geometry Unlike traditional straight-fin heat sinks, the pin-fin design increases surface area and creates turbulence in the airflow. This allows the heat sink to perform effectively in environments where the direction of the airflow might be omnidirectional or inconsistent. #### B. Attachment Mechanism (Push-Pin) * **Ease of Install:** It uses a push-pin and spring system. This ensures a consistent pressure (load) is applied to the electronic component, which optimizes the thermal interface material (TIM) performance. * **Hole Pattern:** It requires pre-drilled holes in the PCB for secure mounting. #### C. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodizing:** This isn't just for aesthetics; the anodized layer provides increased corrosion resistance and slightly improves thermal emissivity. --- ### 3. Application Use-Cases This specific heat sink is typically found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Industrial Computing:** Embedded systems that require passive or active cooling in tight enclosures. 3. **Power Electronics:** Cooling MOSFETs or IGBT modules where heat dissipation is critical for lifespan. --- ### 4. Performance Data (Airflow) Thermal resistance varies based on the Linear Feet per Minute (LFM) of airflow provided by system fans: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 2.50 | | 400 | 1.63 | | 600 | 1.31 |