The **ATS-18G-63-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for secure attachment to Printed Circuit Boards (PCBs). ### 1. Technical Specifications Below are the primary mechanical and thermal characteristics: | Property | Description | | :--- | :--- | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | Push Pin (Brass) with Compression Spring | | **Thermal Resistance** | 3.67°C/W (at 200 LFM) | | **Dimensions** | 45mm x 45mm x 20mm | | **Fin Style** | Straight Fin (Extruded) | | **Regulatory** | RoHS and REACH Compliant | --- ### 2. Core Components & Functionality #### A. The Heat Sink Body * **Geometry:** The 45x45mm square base provides a large surface area for heat dissipation from the component (usually a BGA or FPGA). * **Fin Design:** It utilizes vertical straight fins. This design is optimized for **forced air cooling** environments where a system fan moves air through the fins. * **Material:** Aluminum is used for its high thermal conductivity and lightweight properties. The blue anodized finish provides corrosion resistance and increased emissivity. #### B. Mounting Mechanism (Push Pins) * **The Pins:** Constructed from brass or durable plastic (the "C1" variant typically indicates a brass pin). * **The Springs:** A compression spring is used to ensure a consistent, pre-determined pressure is applied to the thermal interface material (TIM). * **Reliability:** Unlike adhesive tapes, push pins provide a permanent mechanical connection that resists vibration and thermal cycling. #### C. Thermal Interface (TIM) * Standard versions of this part often come with a pre-applied **Phase Change Material (PCM)** or high-performance thermal pad on the base to ensure zero air gaps between the component and the heat sink. --- ### 3. Part Number Breakdown The part number follows the standard ATS nomenclature: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **18G** | Push-pin Series | | **63** | Specific Physical Profile/Fin Count | | **C1** | Attachment Kit (Brass push pins / Plastic Springs) | | **R0** | Revision/Packaging code | --- ### 4. Typical Applications * **Telecommunications:** Cooling high-speed network switches and routers. * **Industrial PC:** Cooling CPUs or GPUs in embedded systems. * **Power Electronics:** Dissipating heat from MOSFET arrays or Voltage Regulators.