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  • ATS-18D-07-C2-R0

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    The **ATS-18D-07-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Value / Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 17.00°C/W (at 100 LFM) | | **Finish** | Blue Anodized | --- ### 2. Physical Dimensions The dimensions are critical for ensuring the part fits onto a Printed Circuit Board (PCB) without interfering with other components. | Dimension | Measurement (mm) | | :--- | :--- | | **Length (A)** | 45.00 mm | | **Width (B)** | 45.00 mm | | **Height (C)** | 12.70 mm | | **Pitch (E)** | 38.00 mm | | **Pitch (F)** | 38.00 mm | --- ### 3. Key Components & Features #### A. The Fin Profile This model uses a **Straight Fin** design. This is ideal for systems with a consistent direction of airflow (undirectional air). The spacing between fins is optimized to minimize pressure drop while maximizing surface area for heat exchange. #### B. The Push-Pin Mechanism Unlike adhesive-based heat sinks, the "Push-Pin" system uses: * **Compression Springs:** Provides consistent pressure on the component (TIM) for better thermal conductivity. * **Plastic/Brass Pins:** Secure the heat sink to pre-drilled holes in the PCB, preventing the heat sink from shifting during vibration or shipping. #### C. Thermal Interface Material (TIM) The "R0" at the end of the part number typically indicates that the unit comes pre-applied with **ATS-PPS-07** (or similar) thermal grease or a phase-change material. This eliminates the need for manual application during assembly. --- ### 4. Thermal Performance Data Performance varies based on the Airflow (LFM - Linear Feet per Minute): | Airflow Velocity | 100 LFM | 300 LFM | 500 LFM | 700 LFM | | :--- | :--- | :--- | :--- | :--- | | **Resistance (°C/W)** | 17.00 | 5.30 | 3.20 | 2.40 | ---
    ✨ Follow-up Questions
    • ⤷ What are the advantages of Push-Pin mounting over thermal adhesive?
    • ⤷ How do I calculate if this heat sink is sufficient for a 10W chip?
    • ⤷ Does this model support bidirectional airflow?