The **ATS-18B-35-C2-R0** is a specific part number for a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW" series, designed for cooling electronic components like CPUs, GPUs, FPGAs, and ASICs. Below is the technical breakdown of its electronic and mechanical parts. --- ## 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Material** | Aluminum (Extruded) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 12.48°C/W (Unducted) | | **Dimensions (L x W x H)** | 35mm x 35mm x 10mm | | **TIM (Thermal Interface)** | T766 (Pre-applied Phase Change Material) | --- ## 2. Component Analysis ### A. The Heat Sink Body (Passive Cooling) The core of this part is an aluminum structure featuring a **high-aspect-ratio fin design**. * **Aluminum Construction:** Provides high thermal conductivity while remaining lightweight. * **Blue Anodized Coating:** This is not just for aesthetics; the anodized layer provides electrical insulation and corrosion resistance while slightly increasing infrared emissivity for better heat radiation. ### B. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, the **R0** suffix indicates a mechanical attachment system. * **Springs:** Provides consistent, high pressure to the interface between the chip and the heat sink. This minimizes the "bond line thickness" of the thermal paste, improving cooling performance. * **Plastic/Brass Pins:** Designed to clip through pre-drilled holes in the printed circuit board (PCB). ### C. Thermal Interface Material (TIM) The **C2** in the part number signifies that it comes with a pre-applied thermal material. * **T766 PCM:** This is a phase-change material that softens as the chip heats up, filling microscopic air gaps between the component and the metal. * **Benefit:** Eliminates the need for manual application of thermal grease, reducing assembly errors in manufacturing. --- ## 3. Use Case Scenarios This part is typically used in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Embedded Systems:** Industrial PCs where vibration makes adhesive heat sinks unreliable. 3. **Power Electronics:** Dissipating heat from MOSFET arrays or Voltage Regulator Modules (VRMs). ---