ATS-12F-99-C2-R0
AI

The **ATS-12F-99-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Attachment Type** | Push-Pin (Plastic or Brass) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 11.52°C/W (Unducted Flow @ 100 LFM) |
| **Base Dimensions** | 45.00mm x 45.00mm |
| **Height** | 20.00mm |
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### 2. Physical Design Features
* **Fin Style:** This model typically utilizes a **Straight Fin** or **Cross-Cut** pattern. The 20mm height provides a significant surface area for air-to-metal contact.
* **Thermal Interface Material (TIM):** The "C2" suffix indicates that it comes pre-applied with a high-performance thermal interface material (usually T766), ensuring low thermal resistance between the chip and the heat sink.
* **Attachment Mechanism:** The "Push-Pin" system uses a spring-loaded mechanism. This ensures constant pressure (load) on the component, which improves heat transfer and prevents the sink from shifting during vibration.
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### 3. Application Use Cases
This specific heat sink is often found in industrial and computing environments:
1. **Telecommunications:** Cooling of networking ASICs and FPGAs.
2. **Power Supplies:** Heat dissipation for MOSFETs and power modules.
3. **Embedded Systems:** Cooling small form-factor industrial PCs.
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### 4. Thermal Performance Comparison
The effectiveness of the ATS-12F-99-C2-R0 depends heavily on the airflow (measured in Linear Feet per Minute - LFM):
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 11.52 |
| 300 (1.5 m/s) | 4.03 |
| 500 (2.5 m/s) | 2.50 |
| 700 (3.5 m/s) | 1.83 |
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- ⤷
What is the hole pattern requirement for mounting this heat sink?
- ⤷ Are there alternative push-pin materials available for high-vibration environments?
- ⤷ How does 'Blue Anodized' finish affect the thermal emissivity of the part?