The **ATS-08F-101-C3-R0** is a high-performance electronic thermal management component. Specifically, it is an **Advanced Thermal Solutions (ATS) push-pin heatsink** designed for cooling integrated circuits (ICs) and other surface-mount components. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Mounting Type** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 6.77°C/W @ 100 LFM | | **Fin Type** | Straight Fin | --- ## 2. Key Components & Materials ### A. The Heatsink Body The main body is made of **Aluminum**, which is chosen for its excellent thermal conductivity-to-weight ratio. The **Blue Anodized** finish is not just aesthetic; it provides: * Increased corrosion resistance. * Improved surface emissivity (enhanced radiant heat transfer). * Electrical insulation of the surface. ### B. The Mounting Mechanism (Push-Pins) This part utilizes a **Push-Pin and Spring** system. * **Plastic Push-Pins:** These provide a secure, vibration-resistant attachment to the PCB. * **Springs:** They provide a precise amount of downward pressure (clamping force) on the electronic component to ensure optimal contact with the thermal interface material (TIM). ### C. Thermal Interface Material (TIM) Usually, these parts come with a **pre-applied phase-change material** or thermal tape on the base. This fills microscopic air gaps between the heatsink and the chip, significantly lowering thermal resistance. --- ## 3. Performance Data (Airflow) Thermal resistance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural) | 6.77 | | 200 | 2.52 | | 300 | 1.70 | | 400 | 1.30 | --- ## 4. Typical Applications This part is commonly used for cooling: * **CPUs/GPUs** in embedded systems. * **FPGAs** (Field Programmable Gate Arrays). * **ASICs** (Application-Specific Integrated Circuits). * High-speed networking equipment and telecommunications modules.