The **ATS-07F-83-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of their "push pin" series, designed for cooling electronic components such as CPUs, GPUs, and power modules. ### 1. Technical Specifications The following table summarizes the physical and thermal characteristics of this specific component: | Parameter | Specification | | :--- | :--- | | **Product Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 20.00mm | | **Pitch / Fin Type** | Fine Pitch / Straight Fin | | **Attachment Method** | Push Pin (Brass/Plastic) | | **Thermal Interface Material (TIM)** | T766 (High Performance) | | **Flow Direction** | Vertical / Horizontal | --- ### 2. Key Components & Design Features #### A. Thermal Performance * **Heat Dissipation:** The straight fin design allows for efficient airflow through the cooling fins. * **Thermal Resistance:** It is designed to lower the temperature of integrated circuits (ICs) by transferring heat into the ambient air. * **TIM (T766):** The part comes pre-applied with a high-performance thermal interface material, ensuring optimal contact between the heat source and the aluminum base. #### B. Mechanical Mounting (Push Pin) Unlike adhesive-based heat sinks, the "push pin" mechanism uses a spring-loaded system to: 1. Provide constant pressure across the chip surface. 2. Allow for secure attachment via pre-drilled holes in the PCB. 3. Offer durability against mechanical shocks and vibrations. #### C. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodizing:** This is not just for aesthetics; the anodized layer provides corrosion resistance and increases surface emissivity, which slightly improves radiative heat transfer. --- ### 3. Typical Applications This electronic part is commonly used in: * **Telecommunications:** Cooling of routers and switches. * **Computing:** Northbridge/Southbridge chips or small form-factor CPUs. * **Industrial Electronics:** Motor controllers and power supply modules where space is constrained but high thermal efficiency is required.