The **ATS-07F-82-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. ### 1. Technical Specifications The following table summarizes the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Heat Sink Type** | Push Pin | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 25.00mm | | **Thermal Resistance (Flow)** | 10.79°C/W (@ 100 LFM) | | **Thermal Resistance (Static)** | 2.14°C/W (@ 700 LFM) | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Features and Components #### A. The pushPIN™ Attachment System The part uses a specialized "pushPIN" system. This includes: * **Flexible Attachment:** It allows for easy mounting to the PCB without specialized tools. * **Spring-Loaded:** The compression springs provide precise pressure to ensure optimal contact with the electronic component, enhancing heat transfer. #### B. Material and Finish * **Aluminum 6063:** This alloy is chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodization:** Beyond aesthetics, the anodized coating protects the aluminum from corrosion and slightly increases emissivity for better radiant heat dissipation. #### C. Fin Design (Cross-Cut) The ATS-07F-82-C2-R0 features a **Straight Fin** or **Cross-Cut** pattern (depending on specific sub-variants). This design maximizes surface area while allowing airflow from multiple directions, making it efficient for "impingement" cooling where a fan blows air directly down onto the heat sink. --- ### 3. Application Use Cases This specific heat sink is typically found in: 1. **Embedded Systems:** Industrial PCs or networking gear. 2. **Power Electronics:** Dissipating heat from VRMs (Voltage Regulator Modules). 3. **Communication Devices:** Modems and routers that require passive or active cooling in a compact form factor. ---