Motor de Búsqueda de Datasheet de Componentes Electrónicos
  Spanish  ▼
ALLDATASHEET.ES

X  

  • ATS-03F-64-C2-R0

  • AI
    The **ATS-03F-64-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is part of their "pushPIN™" series, designed for precision cooling of electronic components like CPUs, GPUs, and power transistors. --- ### 1. Technical Specifications Below are the primary technical attributes of the ATS-03F-64-C2-R0: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 9.39°C/W (at 100 LFM) | | **Flow Orientation** | Vertical Fin (Straight) | | **Dimensions (LxWxH)** | 45mm x 45mm x 25mm | | **Interface Material** | T766 (Thermal Grease) | --- ### 2. Breakdown of the Model Number The part number can be decoded to understand its physical properties: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **03**: Series/Style (pushPIN™ attachment). * **F**: Fin Pitch (Fine pitch for higher surface area). * **64**: Specific footprint/designator (45mm x 45mm). * **C2**: Material/Finish code (Blue Anodized Aluminum). * **R0**: Revision or packaging indicator. --- ### 3. Key Electronic Functions While this is a passive component (it does not use electricity), it is vital for the survival of electronic circuits: * **Heat Dissipation:** It increases the surface area of a heat-generating semiconductor, allowing air to carry away heat more efficiently. * **Thermal Interface:** It utilizes **T766** pre-applied thermal material to bridge the microscopic air gaps between the component and the heatsink. * **Mechanical Stability:** The **pushPIN™** system uses a brass component and a stainless steel spring to provide consistent pressure, ensuring the heatsink stays in contact with the chip during vibration or shipping. --- ### 4. Thermal Performance Data Performance varies based on the airflow (velocity) within the electronic enclosure: | Air Velocity (LFM) | 100 (0.5m/s) | 300 (1.5m/s) | 500 (2.5m/s) | | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 9.39 | 2.50 | 1.45 | *Note: Lower °C/W indicates better cooling efficiency.*
    ✨ Follow-up Questions
    • ⤷ What are the mounting hole dimensions required for the pushPIN system?
    • ⤷ Is this heatsink compatible with active fans?
    • ⤷ How does 'Blue Anodized' finish affect thermal emissivity?