The **ATS-01F-62-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of their "push pin" series designed for cooling integrated circuits (ICs) like processors, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of the device: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Attachment Method** | Push Pin (Brass) | | **Thermal Resistance** | ~16.5°C/W (Unducted Flow @ 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Fin Style** | Straight Fin | --- ### 2. Key Electronic & Mechanical Components #### A. The Heat Sink Body The body is constructed from high-grade aluminum. Its **40x40mm footprint** is a standard size for mid-sized electronic packages. The **15mm height** makes it suitable for low-profile chassis where vertical space is limited. #### B. The Push Pin Mounting System Unlike adhesive-based heat sinks, the ATS-01F-62-C2-R0 uses a mechanical **Push Pin** system: * **Spring-Loaded:** The brass pins include springs that provide consistent downward pressure on the electronic component. * **Reliability:** Mechanical mounting is preferred in high-vibration environments (like industrial or automotive electronics) where thermal tape might fail. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. * **Function:** It fills the microscopic air gaps between the heat sink and the electronic chip to maximize heat transfer. * **Efficiency:** Pre-applied TIM ensures a uniform layer, reducing the risk of "hot spots" caused by improper manual application. --- ### 3. Application Use Cases This part is typically found in the following electronic systems: 1. **Telecommunications:** Cooling network switches and routers. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Managing heat for voltage regulators or power modules. --- ### 4. Thermal Performance Context The efficiency of this part depends heavily on **Airflow (LFM - Linear Feet per Minute)**: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (Low) | 16.48 | | 400 (Medium) | 6.47 | | 600 (High) | 4.45 | *Note: A lower °C/W value indicates better cooling performance.*