Fabricante Electrónico | No. de pieza | Datasheet | Descripción Electrónicos |
Microchip Technology |
33FJ64MC508
|
2Mb/90P
|
dsPIC DSC High-Performance 16-Bit Digital Signal Controllers
08/24/05
|
DSPIC33FJ64MC508
|
228Kb/10P
|
Silicon Errata
2006
|
DSPIC33FJ64MC508
|
988Kb/80P
|
Flash Programming Specification
2007
|
DSPIC33FJ64MC508
|
5Mb/340P
|
16-Bit Digital Signal Controllers
02/04/09
|
DSPIC33FJ64MC508
|
5Mb/340P
|
High-Performance, 16-Bit Digital Signal Controllers
02/04/09
|
Search Partnumber :
Start with "4MC508" -
Total : 74 ( 1/4 Page) |
RMT Ltd. |
4MC04-115-05
|
417Kb/4P |
Thermoelectric Module
|
4MC04-115-05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
4MC04-115-05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
4MC04-115-08
|
417Kb/4P |
Thermoelectric Module
|
4MC04-115-08
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
4MC04-115-10
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
4MC04-115-10
|
417Kb/4P |
Thermoelectric Module
|
4MC04-115-12
|
417Kb/4P |
Thermoelectric Module
|
4MC04-115-12
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
4MC04-115-15
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
4MC04-115-15
|
417Kb/4P |
Thermoelectric Module
|
4MC04115
|
2Mb/8P |
Thermoelectric Cooling Solutions
|
4MC06-103-05
|
250Kb/4P |
Thermoelectric Module
|
4MC06-103-05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
4MC06-103-05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|