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ST72F324J Datasheet(PDF) 146 Page - STMicroelectronics |
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ST72F324J Datasheet(HTML) 146 Page - STMicroelectronics |
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146 / 156 page ![]() ST72324J/K 146/156 13.2 THERMAL CHARACTERISTICS Notes: 1. The power dissipation is obtained from the formula PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD) and PPORT is the port power dissipation determined by the user. 2. The average chip-junction temperature can be obtained from the formula TJ = TA + PD x RthJA. Symbol Ratings Value Unit RthJA Package thermal resistance (junction to ambient) TQFP44 10x10 TQFP32 7x7 SDIP42 600mil SDIP32 200mil 52 70 55 50 °C/W PD Power dissipation 1) 500 mW TJmax Maximum junction temperature 2) 150 °C |
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