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MPXM2102AS Datasheet(PDF) 301 Page - Motorola, Inc

No. de pieza MPXM2102AS
Descripción Electrónicos  Sensor
PDF  670 Pages
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Fabricante Electrónico  MOTOROLA [Motorola, Inc]
Página de inicio  http://www.freescale.com
Logo MOTOROLA - Motorola, Inc

MPXM2102AS Datasheet(HTML) 301 Page - Motorola, Inc

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MPXH6300A SERIES
3–155
Motorola Sensor Device Data
www.motorola.com/semiconductors
Figure 2. Cross Sectional Diagram SSOP
(not to scale)
Figure 3. Typical Application Circuit
(Output Source Current Operation)
WIRE BOND
STAINLESS
STEEL CAP
THERMOPLASTIC
CASE
DIE BOND
SEALED VACUUM REFERENCE
DIE
P1
FLUORO SILICONE
GEL DIE COAT
LEAD
FRAME
ABSOLUTE ELEMENT
VS Pin 2
+5.1 V
GND Pin 3
Vout Pin 4
to ADC
100 nF
51 K
47 pF
MPXH6300A
Figure 2 illustrates the absolute sensing chip in the basic
Super Small Outline chip carrier (Case 1317).
Figure 3 shows a typical application circuit (output source
current operation).
5.0
4.5
4.0
3.5
3.0
Pressure (ref: to sealed vacuum) in kPa
TYP
MAX
MIN
2.5
2.0
1.5
1.0
0.5
0
Figure 4. Output versus Absolute Pressure
TRANSFER FUNCTION:
Vout = Vs* (.00318*P–.00353) ± Error
VS = 5.1 Vdc
TEMP = 0 to 85
°C
Figure 4 shows the sensor output signal relative to pres-
sure input. Typical minimum and maximum output curves
are shown for operation over 0 to 85
°C temperature range.
The output will saturate outside of the rated pressure range.
A fluorosilicone gel isolates the die surface and wire
bonds from the environment, while allowing the pressure
signal to be transmitted to the silicon diaphragm. The
MPXH6300A series pressure sensor operating characteris-
tics, internal reliability and qualification tests are based on
use of dry air as the pressure media. Media other than dry
air may have adverse effects on sensor performance and
long–term reliability. Contact the factory for information re-
garding media compatibility in your application.
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com



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