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STM32L162VE Datasheet(PDF) 122 Page - STMicroelectronics |
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STM32L162VE Datasheet(HTML) 122 Page - STMicroelectronics |
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122 / 129 page ![]() Package information STM32L162xE 122/129 DocID025882 Rev 6 Figure 40. WLCSP104, 0.4 mm pitch wafer level chip scale package recommended footprint Table 68. WLCSP104, 0.4 mm pitch wafer level chip scale package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Min Typ Max Min Typ Max A 0.525 0.555 0.585 0.0207 0.0219 0.023 A1 - 0.175 - - 0.0069 - A2 - 0.38 - - 0.015 - A3(2) 2. Back side coating. - 0.025 - - 0.001 - ø b(3) 3. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 0.22 0.25 0.28 0.0087 0.0098 0.011 D 4.06 4.095 4.13 0.1598 0.1612 0.1626 E 5.059 5.094 5.129 0.1992 0.2006 0.2019 e - 0.4 - - 0.0157 - e1 - 3.2 - - 0.126 - e2 - 4.4 - - 0.1732 - F - 0.447 - - 0.0176 - G - 0.347 - - 0.0137 - aaa - - 0.1 - - 0.0039 bbb - - 0.1 - - 0.0039 ccc - - 0.1 - - 0.0039 ddd - - 0.05 - - 0.002 eee - - 0.05 - - 0.002 |
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