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Motor de Búsqueda de Datasheet de Componentes Electrónicos |
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STM32F410RB Datasheet(PDF) 133 Page - STMicroelectronics |
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STM32F410RB Datasheet(HTML) 133 Page - STMicroelectronics |
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133 / 142 page  DocID028094 Rev 5 133/142 STM32F410x8/B Package information 139 Figure 54. UFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid array package recommended footprint F 0.700 0.750 0.800 0.0276 0.0295 0.0315 ddd - - 0.080 - - 0.0031 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 85. UFBGA64 recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.100 mm Table 84. UFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.460 0.530 0.600 0.0181 0.0209 0.0236 |
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