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STM32F412RG Datasheet(PDF) 162 Page - STMicroelectronics |
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STM32F412RG Datasheet(HTML) 162 Page - STMicroelectronics |
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162 / 193 page ![]() Package information STM32F412xE/G 162/193 DocID028087 Rev 4 7 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 7.1 WLCSP64 package information Figure 60. WLCSP64 - 64-pin, 3.658 x 3.686 mm, 0.4 mm pitch wafer level chip scale package outline 1. Drawing is not to scale. |
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