 |
Motor de Búsqueda de Datasheet de Componentes Electrónicos |
|
|
Motor de Búsqueda de Datasheet de Componentes Electrónicos |
|
GXM Datasheet(PDF) 200 Page - National Semiconductor (TI) |
|
|
|
|||||||||||||||||||||||||||||
GXM Datasheet(HTML) 200 Page - National Semiconductor (TI) |
|
|
200 / 244 page  www.national.com 200 Revision 3.1 Package Specifications (Continued) Table 8-3. Mechanical Package Outline Legend Symbol Meaning A Distance from seating plane datum to highest point of body A1 Solder ball height A2 Laminate thickness (excluding heat spreader) aaa Coplanarity B Pin or solder ball diameter D Largest overall package outline dimension D1 Length from outer pin center to outer pin center D2 Heat spreader outline dimension E1 BGA: Solder ball pitch SPGA: Linear spacing between true pin position centerlines E2 Diagonal spacing between true pin position centerlines F Flatness L Distance from seating plane to tip of pin S1 Length from outer pin/ball center to edge of laminate |
|
Enlace URL |
| ¿ALLDATASHEET es útil para Ud.? [ DONATE ] |
Todo acerca de Alldatasheet | Publicidad | Contáctenos | Política de Privacidad | Enlace a la hoja de datos | Intercambio de Enlaces | Lista de Fabricantes All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
Spanish ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
