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STM32F303VE Datasheet(PDF) 167 Page - STMicroelectronics |
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STM32F303VE Datasheet(HTML) 167 Page - STMicroelectronics |
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167 / 184 page  DocID026415 Rev 4 167/184 STM32F303xD STM32F303xE Package information 182 Figure 58. UFBGA100 - 100-pin, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array recommended footprint Note: Non-solder mask defined (NSMD) pads are recommended. Note: 4 to 6 mils solder paste screen printing process. ddd - - 0.100 - - 0.0039 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 93. UFBGA100 recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 Dpad 0.27 mm Dsm 0.35 mm typ. (depends on the soldermask registration tolerance) Solder paste 0.27 mm aperture diameter. Table 92. UFBGA100 - 100-pin, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. |
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