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PIC18F242 Datasheet(PDF) 312 Page - Microchip Technology

No. de pieza PIC18F242
Descripción Electrónicos  High-Performance, Enhanced Flash Microcontrollers with 10-Bit A/D
PDF  332 Pages
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Fabricante Electrónico  MICROCHIP [Microchip Technology]
Página de inicio  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

PIC18F242 Datasheet(HTML) 312 Page - Microchip Technology

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PIC18FXX2
DS39564C-page 310
© 2006 Microchip Technology Inc.
44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
F
A
A1
A2
α
E
E1
#leads=n1
p
B
D1
D
n
1
2
φ
c
β
L
CH x 45°
1.14
0.89
0.64
.045
.035
.025
CH
Pin 1 Corner Chamfer
1.00 REF.
.039 REF.
F
Footprint (Reference)
Units
INCHES
MILLIMETERS*
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
n
44
44
Pitch
p
.031
0.80
Overall Height
A
.039
.043
.047
1.00
1.10
1.20
Molded Package Thickness
A2
.037
.039
.041
0.95
1.00
1.05
Standoff
A1
.002
.004
.006
0.05
0.10
0.15
Foot Length
L
.018
.024
.030
0.45
0.60
0.75
Foot Angle
φ
03.5
7
0
3.5
7
Overall Width
E
.463
.472
.482
11.75
12.00
12.25
Overall Length
D
.463
.472
.482
11.75
12.00
12.25
Molded Package Width
E1
.390
.394
.398
9.90
10.00
10.10
Molded Package Length
D1
.390
.394
.398
9.90
10.00
10.10
Pins per Side
n1
11
11
Lead Thickness
c
.004
.006
.008
0.09
0.15
0.20
Lead Width
B
.012
.015
.017
0.30
0.38
0.44
Mold Draft Angle Top
α
5
10
15
5
10
15
Mold Draft Angle Bottom
β
5
10
15
5
10
15
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
Notes:
JEDEC Equivalent: MS-026
Revised 07-22-05
* Controlling Parameter
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
Drawing No. C04-076



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