Motor de Búsqueda de Datasheet de Componentes Electrónicos |
|
MCS04020C3309FE000 Datasheet(PDF) 3 Page - Vishay Siliconix |
|
MCS04020C3309FE000 Datasheet(HTML) 3 Page - Vishay Siliconix |
3 / 12 page MCS 0402, MCT 0603, MCU 0805, MCA 1206 - Professional www.vishay.com Vishay Beyschlag Revision: 24-Jan-13 3 Document Number: 28705 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 DIMENSIONS SOLDER PAD DIMENSIONS Note • The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain the reliability of the assembly. Specified power rating above 125 °C requires dedicated heat-sink pads, which depend on board materials. The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other parameters. Still, the given solder pad dimensions will be found adequate for most general applications, e.g. those referring to “standard operation mode”. Please note however that applications for “power operation mode” require special considerations for the design of solder pads and adjacent conductor areas. DIMENSIONS AND MASS TYPE H (mm) L (mm) W (mm) WT (mm) Tt (mm) Tb (mm) MASS (mg) MCS 0402 0.32 ± 0.05 1.0 ± 0.05 0.5 ± 0.05 > 75 % of W 0.2 + 0.1/- 0.15 0.2 ± 0.1 0.6 MCT 0603 0.45 + 0.1/- 0.05 1.55 ± 0.05 0.85 ± 0.1 > 75 % of W 0.3 + 0.15/- 0.2 0.3 + 0.15/- 0.2 1.9 MCU 0805 0.45 + 0.1/- 0.05 2.0 ± 0.1 1.25 ± 0.15 > 75 % of W 0.4 + 0.1/- 0.2 0.4 + 0.1/- 0.2 4.6 MCA 1206 0.55 ± 0.1 3.2 + 0.1/- 0.2 1.6 ± 0.15 > 75 % of W 0.5 ± 0.25 0.5 ± 0.25 9.2 RECOMMENDED SOLDER PAD DIMENSIONS TYPE WAVE SOLDERING REFLOW SOLDERING G (mm) Y (mm) X (mm) Z (mm) G (mm) Y (mm) X (mm) Z (mm) MCS 0402 - - - - 0.35 0.55 0.55 1.45 MCT 0603 0.55 1.10 1.10 2.75 0.65 0.70 0.95 2.05 MCU 0805 0.80 1.25 1.50 3.30 0.90 0.90 1.40 2.70 MCA 1206 1.40 1.50 1.90 4.40 1.50 1.15 1.75 3.80 T b T t L H W W T G X Y Z |
Número de pieza similar - MCS04020C3309FE000 |
|
Descripción similar - MCS04020C3309FE000 |
|
|
Enlace URL |
Política de Privacidad |
ALLDATASHEET.ES |
¿ALLDATASHEET es útil para Ud.? [ DONATE ] |
Todo acerca de Alldatasheet | Publicidad | Contáctenos | Política de Privacidad | Intercambio de Enlaces | Lista de Fabricantes All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |