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STM32F103RCT7 Datasheet(PDF) 116 Page - STMicroelectronics

No. de pieza STM32F103RCT7
Descripción Electrónicos  High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces
PDF  130 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F103RCT7 Datasheet(HTML) 116 Page - STMicroelectronics

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Package characteristics
STM32F103xC, STM32F103xD, STM32F103xE
116/130
Doc ID 14611 Rev 8
Figure 66.
BGA pad footprint
Table 69.
Recommended PCB design rules (0.5mm pitch BGA)
Dimension
Recommended values
Dpad
∅ = 300 µm (circular) - 250 µm recommended
Dsm
∅ = 340 µm min (for 300 µm diameter pad)
PCD pad size
Cu - Ni (2-6 µm) - Au (0.2 µm max)
– Non solder mask defined
– Micro via under bump allowed



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