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PIC12CE673 Datasheet(PDF) 118 Page - Microchip Technology

No. de pieza PIC12CE673
Descripción Electrónicos  8-Pin, 8-Bit CMOS Microcontroller with A/D Converter and EEPROM Data Memory
PDF  130 Pages
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Fabricante Electrónico  MICROCHIP [Microchip Technology]
Página de inicio  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

PIC12CE673 Datasheet(HTML) 118 Page - Microchip Technology

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PIC12C67X
DS30561C-page 118
 1997-2013 Microchip Technology Inc.
8-Lead Ceramic Side Brazed Dual In-line with Window (JW) – 300 mil
7.11
6.86
6.60
.280
.270
.260
U
Lid Width
11.68
11.43
11.18
.460
.450
.440
T
Lid Length
4.34
4.22
4.09
.171
.166
.161
W
Window Diameter
8.23
7.87
7.52
.324
.310
.296
eB
Overall Row Spacing
0.51
0.46
0.41
.020
.018
.016
B
Lower Lead Width
1.52
1.40
1.27
.060
.055
.050
B1
Upper Lead Width
0.30
0.25
0.20
.012
.010
.008
c
Lead Thickness
3.81
3.56
3.30
.150
.140
.130
L
Tip to Seating Plane
13.46
13.21
12.95
.530
.520
.510
D
Overall Length
7.62
7.37
7.11
.300
.290
.280
E1
Package Width
1.14
0.89
0.64
.045
.035
.025
A1
Standoff
3.63
3.12
2.62
.143
.123
.103
A2
Top of Body to Seating Plane
4.70
4.19
3.68
.185
.165
.145
A
Top to Seating Plane
2.54
.100
p
Pitch
8
8
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS
INCHES*
Units
2
1
D
n
T
E1
U
W
c
eB
L
A2
B
B1
A
A1
p
*Controlling Parameter
JEDC Equivalent: MS-015
Drawing No. C04-083
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging



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