 |
Motor de Búsqueda de Datasheet de Componentes Electrónicos |
|
|
Motor de Búsqueda de Datasheet de Componentes Electrónicos |
|
AS3525 Datasheet(PDF) 172 Page - ams AG |
|
|
|||||||||||||||||||||||||||||
AS3525 Datasheet(HTML) 172 Page - ams AG |
|
|
172 / 194 page  AS3525-A/-B C22O22 Data Sheet, Confidential © 2005-2009, austriamicrosystems AG, 8141 Unterpremstaetten, Austria-Europe. All Rights Reserved. www.austriamicrosystems.com Revision 1.13 172 - 194 8 Pinout and Packaging 8.1 Package Variants CTBGA (Thin ChipArray BGA) package technology is used for multi-chip-module (MCM) packaging. The following package variants are available for the product: Table 160 Package Options Product Code Package Balls Ball Matrix Pitch [mm] Height [mm] Size [mm] Application AS3525-A CTBGA 224 15x15, 7 Row 0.8 1.2 13x13 with external SDRAM interface AS3525-B CTBGA 144 12x12, full 0.8 1.2 10x10 w/o external SDRAM interface 8.2 CTBGA224 Package Drawings 8.2.1 Marking Figure 60 CTBGA224 Package Marking AS3525A C22O22 AYWWZZZ Package Code AYYWWZZZ A Y WW ZZZ A … for PB free Year working week assembly/packaging Free choice Figure 61 CTBGA224 Package Drawing |
|
Enlace URL |
| ¿ALLDATASHEET es útil para Ud.? [ DONATE ] |
Todo acerca de Alldatasheet | Publicidad | Contáctenos | Política de Privacidad | Enlace a la hoja de datos | Intercambio de Enlaces | Lista de Fabricantes All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
Spanish ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
