MPC8640DEC datasheet(117/140 Pages) FREESCALE

No. de pieza	MPC8640DEC

Descripción Electrónicos	Integrated Host Processor Hardware Specifications

PDF	140 Pages

Scroll/Zoom	100%

Fabricante Electrónico	FREESCALE [Freescale Semiconductor, Inc]

Página de inicio	http://www.freescale.com

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MPC8640 and MPC8640D Integrated Host Processor Hardware Specifications, Rev. 1

Freescale Semiconductor

117

Thermal

Figure 61. Thermal Performance of Select Thermal Interface Material

The board designer can choose between several types of thermal interface. Heat sink adhesive materials

should be selected based on high conductivity and mechanical strength to meet equipment shock/vibration

requirements. There are several commercially available thermal interfaces and adhesive materials

provided by the following vendors:

The Bergquist Company

800-347-4572

18930 West 78th St.

Chanhassen, MN 55317

Internet: www.bergquistcompany.com

Chomerics, Inc.

781-935-4850

77 Dragon Ct.

Woburn, MA 01801

Internet: www.chomerics.com

Dow-Corning Corporation

800-248-2481

Corporate Center

PO Box 994

Midland, MI 48686-0994

Internet: www.dowcorning.com

0.5

1.5

1020

50607080

Silicone Sheet (0.006 in.)

Bare Joint

Fluoroether Oil Sheet (0.007 in.)

Graphite/Oil Sheet (0.005 in.)

Synthetic Grease

Contact Pressure (psi)

MPC8640DEC Datasheet(PDF) 117 Page - Freescale Semiconductor, Inc