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STM32H533CE Datasheet(PDF) 227 Page - STMicroelectronics |
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STM32H533CE Datasheet(HTML) 227 Page - STMicroelectronics |
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227 / 231 page  DS14539 Rev 1 227/231 STM32H533xx Package information 227 6.10.1 Reference documents • JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air). Available from www.jedec.org. • For information on thermal management, refer to “Thermal management guidelines for STM32 32-bit Arm Cortex MCUs applications” (AN5036) available from www.st.com. ΘJC Thermal resistance junction-case WLCSP39 (2.76 x 2.78 mm) 3.4 °C/W UFQFPN48 (7 x 7 mm) 10.2 LQFP48 (7 x 7 mm) 14.2 LQFP64 (10 x 10 mm) 12 LQFP100 (14 x 14 mm) 9.3 UFBGA100 (7 x 7 mm) 15 LQFP144 (20 x 20 mm) 9.4 UFBGA144 (10 x 10 mm) 14.6 Table 130. Package thermal characteristics (continued) Symbol Definition Parameter Value Unit |
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