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STM32F205RFT6 Datasheet(PDF) 155 Page - STMicroelectronics

No. de pieza STM32F205RFT6
Descripción Electrónicos  ARM®-based 32-bit MCU, 150DMIPs, up to 1 MB Flash/1284KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera
PDF  184 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F205RFT6 Datasheet(HTML) 155 Page - STMicroelectronics

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DocID15818 Rev 15
155/184
STM32F20xxx
Package information
183
Figure 80. WLCSP64+2 - 66-ball, 4.539 x 4.911 mm, 0.4 mm pitch wafer level chip scale
package recommended footprint
e2
-
3.200
-
-
0.1260
-
F
-
0.220
-
-
0.0087
-
G
-
0.386
-
-
0.0152
-
aaa
-
-
0.100
-
-
0.0039
bbb
-
-
0.100
-
-
0.0039
ccc
-
-
0.100
-
-
0.0039
ddd
-
-
0.050
-
-
0.0020
eee
-
-
0.050
-
-
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
Table 89. WLCSP64 recommended PCB design rules (0.4 mm pitch)
Dimension
Recommended values
Pitch
0.4
Dpad
0.225 mm
Dsm
0.290 mm typ. (depends on the soldermask
registration tolerance)
Stencil opening
0.250 mm
Stencil thickness
0.100 mm
Table 88. WLCSP64+2 - 66-ball, 4.539 x 4.911 mm, 0.4 mm pitch wafer level chip scale
package mechanical data (continued)
Symbol
millimeters
inches(1)
Min
Typ
Max
Min
Typ
Max



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