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ST7FLITE25F2M6 Datasheet(PDF) 120 Page - STMicroelectronics |
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ST7FLITE25F2M6 Datasheet(HTML) 120 Page - STMicroelectronics |
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120 / 133 page ![]() ST7LITE2 120/133 PACKAGE CHARACTERISTICS (Cont’d) Table 21. THERMAL CHARACTERISTICS Notes: 1. The maximum chip-junction temperature is based on technology characteristics. 2. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA. The power dissipation of an application can be defined by the user with the formula: PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD) and PPORT is the port power dissipation depending on the ports used in the application. Symbol Ratings Value Unit RthJA Package thermal resistance SO20 (junction to ambient) DIP20 125 63 °C/W TJmax Maximum junction temperature 1) 150 °C PDmax Power dissipation 2) 500 mW |
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