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CLRC63201T/0FE Datasheet(PDF) 160 Page - NXP Semiconductors

No. de pieza CLRC63201T/0FE
Descripción Electrónicos  Multiple Protocol Contactless Reader IC
PDF  163 Pages
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Fabricante Electrónico  PHILIPS [NXP Semiconductors]
Página de inicio  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

CLRC63201T/0FE Datasheet(HTML) 160 Page - NXP Semiconductors

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Philips Semiconductors
Product Specification Rev. 3.0; May 2003
Multiple Protocol Contactless Reader IC
CL RC632
160
Confidential
25 PACKAGE OUTLINES
25.1 SO32
UNIT
A
max.
A1
A2
A3
bp
cD(1)
E(1)
eHE
LLp
QZ
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
inches
2.65
0.10
0.25
0.01
1.4
0.055
0.3
0.1
2.45
2.25
0.49
0.36
0.27
0.18
20.7
20.3
7.6
7.4
1.27
10.65
10.00
1.2
1.0
0.95
0.55
8
0
o
o
0.25
0.1
0.004
0.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT287-1
(1)
0.012
0.004
0.096
0.086
0.02
0.01
0.050
0.047
0.039
0.419
0.394
0.30
0.29
0.81
0.80
0.011
0.007
0.037
0.022
0.01
0.01
0.043
0.016
w M
bp
D
HE
Z
e
c
v M A
X
A
y
32
17
16
1
θ
A
A1
A2
Lp
Q
detail X
L
(A )
3
E
pin 1 index
0
5
10 mm
scale
SO32: plastic small outline package; 32 leads; body width 7.5 mm
SOT287-1
95-01-25
97-05-22
Figure 255-1: Outline and Dimension of CL RC632 in SO32



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