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ASM330LHB Datasheet(PDF) 115 Page - STMicroelectronics |
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ASM330LHB Datasheet(HTML) 115 Page - STMicroelectronics |
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115 / 131 page ![]() 14 Soldering information The LGA package is compliant with the ECOPACK and RoHS standard. It is qualified for soldering heat resistance according to JEDEC J-STD-020. For land pattern and soldering recommendations, consult technical note TN0018 available on www.st.com. ASM330LHB Soldering information DS13773 - Rev 7 page 115/131 |
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