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STM32U535NET6QTR Datasheet(PDF) 264 Page - STMicroelectronics

No. de pieza STM32U535NET6QTR
Descripción Electrónicos  Ultra-low-power Arm® Cortex®-M33 MCUTrustZone®FPU,240 DMIPS, up to 512 KB flash memory, 274 KB SRAM
PDF  278 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32U535NET6QTR Datasheet(HTML) 264 Page - STMicroelectronics

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Package information
STM32U535xx
264/278
DS14217 Rev 1
6.5
WLCS56 package information
This WLCSP is a 56-ball, 3.3 x 3.38 mm, 0.40 mm pitch, wafer level chip scale package.
Figure 68. WLCSP56 - Outline
1. Drawing is not to scale.
2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
3. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
4. Bump position designation per JESD 95-1, SPP-010. The tolerance of position that controls the location of the pattern of
balls with respect to datums X and Y. For each ball there is a cylindrical tolerance zone ccc perpendicular to datum Z and
located on true position with respect to datums X and Y as defined by e. The axis perpendicular to datum Z of each ball
must lie within this tolerance zone.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
G
F
e1
A1 BALL LOCATION
e
e2
A
B
C
D
E
F
G
H
e
BOTTOM VIEW
SIDE VIEW
FRONT VIEW
TOP VIEW
DETAIL A
ROTATED 90
(not in scale)
A1
bbb Z
DETAIL A
A
A2
SEATING PLANE
ccc
ddd
Z
Z XY
eee Z
Z
BUMP
b (56x)
B0H4_WLCSP56_ME_V1
A1 ORIENTATION
REFERENCE
X
aaa
(4X)
Y
D
E
A3



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