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KSZ9567RTXI-TR Datasheet(PDF) 225 Page - Microchip Technology

No. de pieza KSZ9567RTXI-TR
Descripción Electrónicos  7-Port Gigabit Ethernet Switch with Audio Video Bridging and Two RGMII/MII/RMII Interfaces
PDF  232 Pages
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Fabricante Electrónico  MICROCHIP [Microchip Technology]
Página de inicio  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

KSZ9567RTXI-TR Datasheet(HTML) 225 Page - Microchip Technology

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 2017-2019 Microchip Technology Inc.
DS00002329D-page 225
KSZ9567R
FIGURE 8-3:
PACKAGE (LAND PATTERN)
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Center Pad Width
Contact Pad Spacing
Center Pad Length
Contact Pitch
Y2
X2
10.50
10.50
MILLIMETERS
0.40 BSC
MIN
E
MAX
15.40
Contact Pad Length (X128)
Contact Pad Width (X128)
Y1
X1
1.54
0.20
Microchip Technology Drawing C04-2418B
NOM
128-Lead Thin Quad Flatpack (6XX) - 14x14x1.0 mm Body [TQFP]
1
2
128
C1
Contact Pad Spacing
15.40
Contact Pad to Contact Pad (X124)
G1
0.20
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.33
1.20
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
With 10x10 mm Exposed Pad
E
C1
C2
X2
Y2
X1
EV
PIN 1 INDEX
ØV
EV
Y1
SILK SCREEN
G1
3



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