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STM32F103XC Datasheet(PDF) 114 Page - STMicroelectronics |
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STM32F103XC Datasheet(HTML) 114 Page - STMicroelectronics |
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114 / 143 page  Package information STM32F103xC, STM32F103xD, STM32F103xE 114/143 DS5792 Rev 13 6 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 6.1 LFBGA144 package information Figure 62. LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm, 0.8 mm pitch, package outline 1. Drawing is not to scale. Table 65. LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm, 0.8 mm pitch, package mechanical data Symbol millimeters inches(1) Min Typ Max Typ Min Max A(2) - - 1.700 - - 0.0669 A1 0.250 0.300 0.350 0.098 0.0118 0.0138 A2 0.810 0.910 1.010 0.0319 0.0358 0.0398 A3 0.225 0.26 0.295 0.0089 0.0102 0.0116 A4 0.585 0.650 0.715 0.0230 0.0256 0.0281 |
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