7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply voltage

VBAT

–0.3

6

V

IN+, IN–

–0.3

VBAT + 0.3

V

Output continuous total power dissipation

See the Section 7.4

Minimum load impedance

6

Ω

–40

85

°C

–40

150

°C

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN

NOM

MAX UNIT

Supply voltage, VBAT

2.5

5.2

V

High–level input voltage, END, ENB

1.3

V

Low–level input voltage, END, ENB

0.6

V

Operating free-air temperature

–40

85

°C

Operating junction temperature

–40

150

°C

7.4 Thermal Information

THERMAL METRIC(1)

TPA2015D1

UNIT

YZH (DSBGA)

16 PINS

Junction-to-ambient thermal resistance

75

°C/W

Junction-to-case (top) thermal resistance

22

°C/W

Junction-to-board thermal resistance

26

°C/W

Junction-to-top characterization parameter

0.5

°C/W

Junction-to-board characterization parameter

25

°C/W

Junction-to-case (bottom) thermal resistance

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

TPA2015D1

SLOS638C – NOVEMBER 2011 – REVISED JUNE 2022

www.ti.com

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