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SN012020 Datasheet(PDF) 4 Page - Texas Instruments |
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SN012020 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 40 page 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT Supply voltage VBAT –0.3 6 V Input Voltage, VI IN+, IN– –0.3 VBAT + 0.3 V Output continuous total power dissipation See the Section 7.4 Minimum load impedance 6 Ω Operating free-air temperature, TA –40 85 °C Operating junction temperature, TJ –40 150 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22- C101(2) ±500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions MIN NOM MAX UNIT Supply voltage, VBAT 2.5 5.2 V VIH High–level input voltage, END, ENB 1.3 V VIL Low–level input voltage, END, ENB 0.6 V TA Operating free-air temperature –40 85 °C TJ Operating junction temperature –40 150 °C 7.4 Thermal Information THERMAL METRIC(1) TPA2015D1 UNIT YZH (DSBGA) 16 PINS RθJA Junction-to-ambient thermal resistance 75 °C/W RθJC(top) Junction-to-case (top) thermal resistance 22 °C/W RθJB Junction-to-board thermal resistance 26 °C/W ψJT Junction-to-top characterization parameter 0.5 °C/W ψJB Junction-to-board characterization parameter 25 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. TPA2015D1 SLOS638C – NOVEMBER 2011 – REVISED JUNE 2022 www.ti.com 4 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: TPA2015D1 |
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