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SPC584BX Datasheet(PDF) 112 Page - STMicroelectronics

No. de pieza SPC584BX
Descripción Electrónicos  32-bit Power Architecture microcontroller for automotive ASIL-B applications
PDF  142 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

SPC584BX Datasheet(HTML) 112 Page - STMicroelectronics

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Package information
SPC584Bx
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DS11701 Rev 4
Figure 50. eTQFP100 leadframe pad design
5.3
eTQFP144 package information
Refer to Section 5.3.1: Package mechanical drawings and data information for full
description of below figures and table notes.
Note: number, dimensions and positions of grooves are for reference only.
Table 64. eTQFP100 symbol definitions
Symbol
Definition
Notes
aaa
The tolerance that controls the position of the
terminal pattern with respect to Datum A and B. The
center of the tolerance zone for each terminal is
defined by basic dimension e as related to Datum A
and B.
For flange-molded packages, this tolerance also
applies for basic dimensions D1 and E1. For
packages tooled with intentional terminal tip
protrusions, aaa does not apply to those
protrusions.
bbb
The bilateral profile tolerance that controls the
position of the plastic body sides. The centers of the
profile zones are defined by the basic dimensions D
and E.
—
ccc
The unilateral tolerance located above the seating
plane where in the bottom surface of all terminals
must be located.
This tolerance is commonly know as the
“coplanarity” of the package terminals.
ddd
The tolerance that controls the position of the
terminals to each other. The centers of the profile
zones are defined by basic dimension e.
This tolerance is normally compounded with
tolerance zone defined by “b”.



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