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STM32WB10CC Datasheet(PDF) 103 Page - STMicroelectronics |
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STM32WB10CC Datasheet(HTML) 103 Page - STMicroelectronics |
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103 / 110 page  DS13259 Rev 2 103/110 STM32WB10CC Package information 107 7 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 7.1 UFQFPN48 package information UFQFPN48 is a 48-lead, 7 x 7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package. Figure 24. UFQFPN48 outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package, it must be electrically connected to the PCB ground. A0B9_ME_V3 D Pin 1 identifier laser marking area EE D Y D2 E2 Exposed pad area Z 1 48 Detail Z R 0.125 typ. 1 48 L C 0.500x45° pin1 corner A Seating plane A1 b e ddd Detail Y T |
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